Tungsten Target Parameters | ||||
Element | W | |||
Purity | ≥99.95%(3N5) | |||
Typical sample dimension | 12mm×80mm×100mm | |||
Density | 19.25 g/cm3 (HIP) | |||
Hardness | HV5:280-310 | |||
Grain Size | 43μm | |||
Appearance | Ra≤0.4μm | |||
Impurity Content | Ti | ≤10ppm | Ni | ≤6ppm |
Na | ≤5ppm | Pb | ≤1ppm | |
C | ≤20ppm | P | ≤8ppm | |
Ca | ≤10ppm | Cu | ≤5ppm | |
Mg | ≤7ppm | |||
Si | ≤10ppm | |||
Al | ≤5ppm | |||
As | ≤10ppm | |||
Fe | ≤10ppm |
Widely used in flat display, solar cell, integrated circuit, automotive glass, microelectronics, memory, X-ray tube, medical equipment, melting equipment and other products.
In addition to tungsten targets, we can also provide tungsten-titanium, silver- tungsten, tungsten-molybdenum, nickel-tungsten, tungsten trioxide, tungsten sulfide, tungsten diboride, tungsten oxide and other sputtering targets.
The tungsten target is a part of the anode that is strategically set at a 45-degree angle in the copper block. This specific positioning is designed to increase the surface area that will be interacting with the incoming electrons. This interaction is vital in the production of X-rays in medical imaging devices, as well as in the creation of thin films in electronics.
Moreover, the 45-degree angle helps to more evenly distribute the heat across the target. This is a critical feature as it prevents the metal from melting, ensuring the longevity and performance of the equipment.